Thermal performance analysis of a commercial System-on-Chip three-phase motor controller

In this master’s thesis, the thermal performance of a System-on-Chip (SoC) with an integrated microcontroller and three-phase MOSFET inverter is analyzed. The mathematical expressions for the power losses in the three-phase MOSFET inverter, based on the PWM control method, are derived and presented. Furthermore, a numerical reference for these losses is developed to verify the analytical expressions. Laboratory measurements are conducted to validate the SPICE simulations. The numerical analysis is based on the space vector reference representation of the three-phase voltage. The results of the numerical analysis are consistent with the outcomes of the analytical equations. However, when comparing simulation results to real-world power loss calculations obtained from laboratory measurements, the losses in the MOSFET inverter are, on average, up to 14% higher than the simulation results. Despite this discrepancy, the simulation model proves reliable for determining the expected junction temperature under specified load conditions.